Samsung Electronics and AMD signed a memorandum of understanding on Wednesday to expand their cooperation in the key memory sector of artificial intelligence infrastructure and explore potential chip foundry collaboration.
According to a statement from both parties, Samsung will provide next-generation high bandwidth memory HBM4 for AMD's upcoming Instinct MI455X accelerator and offer an optimized DDR5 memory solution for its sixth-generation EPYC processors.
The agreement further solidifies Samsung's position in the HBM supply chain. Previously, the company provided HBM3E chips for AMD's MI350X and MI355X accelerators.
Both parties also stated that they will evaluate the possibility of Samsung offering wafer foundry services for AMD's next-generation products, indicating that the collaboration is extending from memory supply to a broader semiconductor manufacturing field.
This announcement comes as NVIDIA is holding its annual GTC developer conference. NVIDIA CEO Jensen Huang also highlighted their cooperation with Samsung in the HBM4 and foundry sectors at the event.
